Semiconductor chip

Details Semiconductor chip Semiconductor chip

2008-11-11

2010-10-19

Sandvik, Benjamin P (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Gate arrays

With particular chip input/output means

C257SE27110

Reexamination Certificate

active

07816708

ABSTRACT:
In a semiconductor chip in which external connection pads are arranged in three or more rows in a staggered configuration at the peripheral portion thereof, a first pad which is arranged in the outermost row is used as a power supply pad or a ground pad for an internal core circuit. To the first pad, a second pad which is arranged in the second outermost row is connected with a metal in the same layer as a pad metal. The resistance of a power supply line to the internal core circuit has a value of the parallel resistance of a resistance from the first pad and a resistance from the second pad, which is by far lower than the resistance from the first pad. Therefore, it is possible to prevent circuit misoperation resulting from an IR drop in the power supply of the internal core circuit.

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