Active solid-state devices (e.g. – transistors – solid-state diode – Thin active physical layer which is – Heterojunction
Reexamination Certificate
2007-06-26
2007-06-26
Lee, Hsien-Ming (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Thin active physical layer which is
Heterojunction
C257S066000, C257S094000, C438S268000, C438S270000
Reexamination Certificate
active
11292911
ABSTRACT:
A method including forming a via dielectric layer on a semiconductor device substrate; forming a trench dielectric layer on the via dielectric layer; forming a trench through the trench dielectric layer to expose the via dielectric layer; forming a via in the via dielectric layer through the trench to expose the substrate; and forming a semiconductor material in the via and in the trench. An apparatus including a device substrate; a dielectric layer formed on a surface of the device substrate; and a device base formed on the dielectric layer including a crystalline structure derived from the device substrate.
REFERENCES:
patent: 5273921 (1993-12-01), Neudeck et al.
patent: 5646058 (1997-07-01), Taur et al.
patent: 6271104 (2001-08-01), Razeghi et al.
patent: 6391721 (2002-05-01), Nakagawa
patent: 6495385 (2002-12-01), Xie
patent: 6602758 (2003-08-01), Kizilyalli et al.
patent: 6653657 (2003-11-01), Kawasaki et al.
patent: 6784101 (2004-08-01), Yu et al.
patent: 199 28 564 (1999-06-01), None
patent: 19928564 (1999-06-01), None
patent: 02087632 (1990-03-01), None
Boyanov Boyan I.
Chau Robert S.
Datta Suman
Doczy Mark L.
Doyle Brian S.
Blakely , Sokoloff, Taylor & Zafman LLP
Intel Corporation
Lee Hsien-Ming
LandOfFree
Semiconductor channel on insulator structure does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor channel on insulator structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor channel on insulator structure will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3819904