Measuring and testing – Instrument proving or calibrating – Volume of flow – speed of flow – volume rate of flow – or mass...
Patent
1998-05-29
2000-08-01
Bueker, Richard
Measuring and testing
Instrument proving or calibrating
Volume of flow, speed of flow, volume rate of flow, or mass...
216 2, 216 84, 438 14, 427336, G01N 1102
Patent
active
060949651
ABSTRACT:
Semiconductor wafer coating system calibration structures and methods are described. In one embodiment, a calibration structure includes a perimetral edge bounding a calibration body. A calibration edge is spaced from the perimetral edge and is positioned over the calibration body. Together, the edges define a distance therebetween which is configured to calibrate a wafer coating system. In a preferred embodiment, the edges define respective termination distances configured to calibrate multiple different wafer coating systems. In another embodiment, a calibration pattern is formed over a semiconductor wafer. A layer of material is formed over the calibration pattern by a coating system, and selected portions thereof removed by the system. The positions of unremoved portions of the layer of material are inspected relative to the calibration pattern to ascertain whether the coating system removed the selected portions within desired tolerances. If not, the coating system is calibrated to within desired tolerances.
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Hubbard Walter B.
Napolitano Lisa
Bueker Richard
Powell Alva C.
VLSI Technology Inc.
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