Refrigeration – Structural installation – With electrical component cooling
Reexamination Certificate
2005-02-22
2005-02-22
Doerrler, William C. (Department: 3744)
Refrigeration
Structural installation
With electrical component cooling
C062S121000, C062S310000, C062S171000, C165S080400
Reexamination Certificate
active
06857283
ABSTRACT:
A semiconductor burn-in thermal management system for providing an effective thermal management system capable of maintaining a desired semiconductor temperature during a burn-in cycle. The semiconductor burn-in thermal management system includes a reservoir for storing a volume of fluid, a pump fluidly connected to the reservoir, and a plurality of spray units fluidly connected to the pump. The spray units dispense the fluid upon the surface of the semiconductor during burn-in thereby maintaining a relatively constant surface temperature. Each of the spray units preferably includes a stationary first portion with a second portion movably positioned within the first portion in a biased manner. When burning in semiconductors without an integrated heat sink that are deeply recessed within the sockets of a burn-in board, the fluid pressure to the second portion is increased thereby extending the second portion from the first portion thereby reducing the effective distance from the surface of the semiconductor.
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Cader Tahir
Muoio Nathan G.
Tilton Charles L.
Tolman Benjamin H.
Doerrler William C.
Isothermal Systems Research Inc.
Neustel Michael S.
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