Semiconductor bonding tool

Details Semiconductor bonding tool Semiconductor bonding tool

1990-05-22

1993-06-08

Heinrich, Samuel M.

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Wire lead bonder

228 447, B23K 300

Patent

active

052171540

ABSTRACT:
The disclosure relates to a bonding tool tip bonding electronic interconnects having a shank portion formed of a relatively hard, stiff material having a high modulus of elasticity and a foot portion formed of polycrystalline diamond bonded to the shank portion. The shank portion is preferably formed of tungsten carbide. The foot portion can have an aperture therethrough for feeding of wire to be welded.

REFERENCES:
patent: 3627192 (1971-12-01), Killingsworth
patent: 4629373 (1986-12-01), Hall
patent: 4667867 (1987-05-01), Dobbs et al.
patent: 4767050 (1988-08-01), Flood et al.
patent: 4890782 (1990-01-01), Nakai et al.
IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. CHMT-2, No. 3, pp. 283-288, Sep. 1979.
Western Electric, "Multidirectional Ultrasonic Wire Bonding Tip", Avedissian, Technical Digest No. 20, p. 78, Oct. 1970.

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