Semiconductor bonding package

Details Semiconductor bonding package Semiconductor bonding package

1996-04-12

1998-03-24

Whitehead, Carl W.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Wire contact, lead, or bond

257734, 257737, 257738, 257780, H01L 2348, H01L 2352, H01L 2940

Patent

active

057316368

ABSTRACT:
An improved semiconductor apparatus having conductive metallic protrusions formed on a bonding pad, thus improving an interconnection between a bonding pad and a bump formed on a substrate, which includes conductive metallic protrusions formed on said bonding pad of said substrate.

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patent: 5120665 (1992-06-01), Tsukagoshi et al.
patent: 5189507 (1993-02-01), Carlomagno et al.
patent: 5598036 (1997-01-01), Ho
Repairable Plastic ball Grid Array Package, IBM Technical Disclosure Bulletin, vol. 38, No. 7 snd 265-266.

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