Semiconductor bond pad structure and increased bond pad count pe

Details Semiconductor bond pad structure and increased bond pad count pe Semiconductor bond pad structure and increased bond pad count pe

1995-02-10

1996-10-15

Picardat, Kevin N.

Fishing, trapping, and vermin destroying

437195, 437211, 437214, 437216, 437217, 437220, H01L 2160

Patent

active

055653855

ABSTRACT:
Composite bond pad structure and geometry increases bond pad density and reduces lift-off problems. Bond pad density is increased by laying out certain non-square bond pads which are shaped, sized and oriented such that each bond pad closely conforms to the shape of the contact footprint made therewith by a bond wire or lead frame lead and aligns to the approach angle of the conductive line to which it is connected. Alternating, interleaved, complementary wedge-shaped bond pads are discussed. Bond pad liftoff is reduced by providing an upper bond pad, a lower bond pad and an insulating component between the upper and lower bond pads. At least one opening is provided through the insulating component, extending from the bottom bond pad to the upper bond pad. The at least one opening is aligned with a peripheral region of the bottom bond pad and is filled with conductive material.

REFERENCES:
patent: 4914054 (1990-04-01), Moriyama et al.
patent: 5073521 (1991-12-01), Braden
patent: 5166096 (1992-11-01), Cote et al.
patent: 5169802 (1992-12-01), Yeh
patent: 5339518 (1994-08-01), Tran et al.
patent: 5441917 (1995-08-01), Rostoker et al.

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