Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
2007-07-12
2010-11-23
Williams, Alexander O (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
C257SE23080, C257SE23101, C257SE23087, C257S676000, C257S678000, C257S712000, C257S713000, C257S704000, C257S707000, C257S782000
Reexamination Certificate
active
07838985
ABSTRACT:
A semiconductor assembly includes a first subassembly comprising a heat sink and a first patterned polymer layer disposed on a surface of the heat sink to define an exposed portion of the first surface. The exposed portion of the first surface extends radially inward along the heat sink surface from the first layer. The subassembly also includes a second patterned polymer layer disposed on a radially outer portion of the first patterned polymer layer. The first and second layers define a cell for accommodating a power semiconductor die. Solder material is disposed on the exposed portion of the heat sink surface and in the cell. A power semiconductor die is located within the cell on a radially inward portion of the first layer and thermally coupled to the heat sink by the solder material.
REFERENCES:
patent: 4043027 (1977-08-01), Birchler et al.
patent: 4504435 (1985-03-01), Orcutt
patent: 4858073 (1989-08-01), Gregory
patent: 5070039 (1991-12-01), Johnson et al.
patent: 5198964 (1993-03-01), Ito et al.
patent: 5311060 (1994-05-01), Rostoker et al.
patent: 5989474 (1999-11-01), Suzuki
patent: 6362517 (2002-03-01), Bell et al.
patent: 6587344 (2003-07-01), Ross
patent: 6624522 (2003-09-01), Standing et al.
patent: 6693349 (2004-02-01), Akram
patent: 6710438 (2004-03-01), Yeo et al.
patent: 6757968 (2004-07-01), Lo et al.
patent: 6890845 (2005-05-01), Standing et al.
patent: 7038311 (2006-05-01), Woodall et al.
patent: 7202111 (2007-04-01), Chiu
patent: 7527090 (2009-05-01), Dani et al.
patent: 2004/0261980 (2004-12-01), Dani et al.
patent: 2005/0046035 (2005-03-01), Egawa
patent: 2008/0185713 (2008-08-01), Dani et al.
patent: 2008/0290378 (2008-11-01), Myers et al.
patent: 2009/0014862 (2009-01-01), Chiang et al.
patent: 2003-087739 (2002-07-01), None
Chiang Wan-Lan
Lin Kuang Hann
Peng Chih-Ping
Mayer & Williams PC
Mayer, Esq. Stuart H
Vishay General Semiconductor LLC
Williams Alexander O
Williams Esq. Karin L.
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