Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2005-12-27
2005-12-27
Williams, Alexander Oscar (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S685000, C257S723000, C257S678000, C257S778000, C257S777000, C257S724000, C361S729000, C361S790000, C361S784000, C361S703000
Reexamination Certificate
active
06979895
ABSTRACT:
A semiconductor package comprising multiple stacked substrates having flip-chips attached to the substrates with chip-on-board assembly techniques to achieve dense packaging. The substrates are preferably stacked atop one another by electric connections which are column-like structures. The electric connections achieve electric communication between the stacked substrates, must be of sufficient height to give clearance for the components mounted on the substrates, and should preferably be sufficiently strong enough to give support between the stacked substrates.
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Akram Salman
Brooks Jerry M.
Micro)n Technology, Inc.
TraskBritt
Williams Alexander Oscar
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