Semiconductor assembly employing noneutectic alloy for heat diss

Details Semiconductor assembly employing noneutectic alloy for heat diss Semiconductor assembly employing noneutectic alloy for heat diss

1984-09-20

1986-08-19

James, Andrew J.

357 79, H01L 2326, H01L 21447, H01L 2310

Patent

active

046072772

ABSTRACT:
A cooling means for a circuit chip device employs a noneutectic metal alloy to form a low thermal resistance bridging interface between the surface of the chip device and a heat sink. The alloy has a solidus-liquidus temperature range such that the solidus is slightly below the maximum operating temperature of the chip, and thus has the capability to reestablish and maintain the interface at a low thermal resistance if stressed during circuit operation, even with a low current load at the interface of the chip device and the heat sink. In addition to the chip interface, the above cooling means is also used at other interfacial regions of the heat sink, dependent on design, to achieve very low thermal resistance.

REFERENCES:
patent: 3271638 (1966-09-01), Murad
patent: 4193445 (1980-03-01), Chu et al.
patent: 4462463 (1984-07-01), Meagher et al.

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