Semiconductor arrangement and method for producing a...

Details Semiconductor arrangement and method for producing a... Semiconductor arrangement and method for producing a...

2011-03-08

2011-03-08

Wilczewski, Mary (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Wire contact, lead, or bond

C257S690000, C257SE21001, C257SE23167

Reexamination Certificate

active

07902683

ABSTRACT:
A semiconductor arrangement having at least one semiconductor chip, which has, on one surface, an integrated circuit and at least one contact element which is electrically conductively connected to the latter, and having an edge protector, which at least partially covers an edge region on the surface of the semiconductor, the edge region extending along outer edges of the semiconductor chip. A method for manufacturing the above-mentioned semiconductor arrangement.

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Imamura, Yoichi “Electrode Periphery Structrure of Semiconductor Device” Feb. 25, 1991, JP 03044046 Schreiber Tanslations.
Sugawara et al. “Semconductor Device” Feb. 18, 1985, JP 60031244 Tanslation FLS Inc.

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