Semiconductor apparatus with multiple delivery devices for...

Details Semiconductor apparatus with multiple delivery devices for... Semiconductor apparatus with multiple delivery devices for...

2007-02-20

2007-02-20

Gray, Linda (Department: 1734)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S064000, C156S249000, C156S302000, C156S351000, C156S378000, C156S541000, C156S560000, C156S569000, C414S751100, C414S798300, C414S798900, C901S030000, C700S248000, C700S121000, C700S249000, C700S259000

Reexamination Certificate

active

10454259

ABSTRACT:
An apparatus is provided for transferring components from a pick-up position amongst a supply of components to a placement position on a receptor, such as a die pad, during semiconductor processing. It includes a first delivery device and a second delivery device operative to alternatively transfer the components from the pick-up position to the placement position. The second delivery device is arranged opposite the first delivery device about a line passing through the pick-up position and the placement position.

REFERENCES:
patent: 3616948 (1971-11-01), Imhof et al.
patent: 3921821 (1975-11-01), Champion et al.
patent: 4824633 (1989-04-01), Ichikawa et al.
patent: 4890241 (1989-12-01), Hoffman et al.
patent: 6248201 (2001-06-01), Boyd et al.
patent: 6658324 (2003-12-01), Bancroft et al.
patent: 6742561 (2004-06-01), Nam et al.
patent: 2003-007731 (2003-01-01), None

Affiliated with

Also associated with

Rating

Semiconductor apparatus with multiple delivery devices for... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor apparatus with multiple delivery devices for..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor apparatus with multiple delivery devices for... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3812664