Semiconductor apparatus with integral heat sink tab

Details Semiconductor apparatus with integral heat sink tab Semiconductor apparatus with integral heat sink tab

1980-12-24

1983-06-07

Tolin, G. P.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361405, 357 81, 174 16HS, H05K 720

Patent

active

043874134

ABSTRACT:
A semiconductor package is provided in which the semiconductor element is bonded to a slab of metal and is encapsulated in a body of insulating epoxy. Lead terminals are connected to the semiconductor element within the body and extend out from one end of the body. The metal slab extends out from the body from the same end as the lead terminals and in a plane which is parallel to that of the terminals, thereby forming a heat sink tab for the device. The package may be rigidly mounted on a printed circuit board by inserting the lead terminals and the heat sink tab into respective holes in a printed circuit board and soldering the terminals and tab to copper foil on the board. The solder connection of the heat sink tab to the copper foil provides an excellent thermal contact between the tab and the foil, in addition to providing a rigid support for the device.

REFERENCES:
patent: 3259814 (1966-07-01), Green
patent: 3519889 (1970-07-01), Monaco
patent: 3665256 (1972-05-01), Goun et al.
patent: 4038678 (1977-07-01), Gottbreht
patent: 4054901 (1977-10-01), Edwards
patent: 4068289 (1978-01-01), Ferrigno
patent: 4254447 (1981-03-01), Griffis
patent: 4270138 (1981-05-01), Desmond
TDA 2030, Linear Integrated Circuit, 5/1978.
RCA Linear Integrated Circuits, 11/1978, p. 480.
U.S. Application 210,838, Transistor Heat Sink Assembly, 11/26/80, Ramspacher et al.

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