Semiconductor apparatus with a multiple element electrode struct

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

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257666, 257692, 257698, 257784, 257728, 333247, H01L 23495, H01L 2334, H01P 100

Patent

active

056988982

ABSTRACT:
A bolt (42a) is connected to a copper plate (9a) by a first electrode (51a), a second electrode (52a) and a wire (10a) for connecting the first and second electrodes. Similarly, a bolt (42b) is connected to a copper plate (9b) by a first electrode (51b), a second electrode (52b) and a wire (10b) for connecting the first and second electrodes. The wires (10a, 10b) are flexible and made of aluminum, for example. Electrical connection can be kept and the upper bound of absorption of the stress applied between the bolts (42a, 42b) and the copper plates (9a, 9b) can be increased.

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