Semiconductor apparatus of module installing type

Details Semiconductor apparatus of module installing type Semiconductor apparatus of module installing type

1992-10-15

1994-05-24

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

257707, 361764, H05K 720

Patent

active

053154827

ABSTRACT:
A semiconductor apparatus comprises a heat diffusing plate and a surface installing printed board. A semiconductor device of a high heat generation is installed on the heat diffusing plate. A surface installing package and chip parts are installed on both surfaces of the printed board. A through hole is formed at the center of the printed board so that the semiconductor device is located at the center. The heat diffusing plate on which the semiconductor device has been installed and the surface installing printed board are connected and integrated.

REFERENCES:
patent: 4630172 (1986-12-01), Stenerson
patent: 4860165 (1989-08-01), Cassinelli
patent: 4982311 (1991-01-01), Dehaine
patent: 5012386 (1991-04-01), McShane
patent: 5130889 (1992-07-01), Hamburgen
patent: 5191511 (1993-03-01), Sawaya
Electronic Packaging Technology, Hitachi, vol. 6, No. 3, Mar. 1990, pp. 57-60.

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