Semiconductor apparatus, LED print head, and printer

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Charge transfer device

Reexamination Certificate

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Details

C257S232000, C257S233000, C257S234000, C257S048000, C257S088000, C257S072000, C257SE33055

Reexamination Certificate

active

07456449

ABSTRACT:
A semiconductor apparatus has a substrate to which is attached a thin semiconductor film including at least one semiconductor device. An interconnecting line links the semiconductor film with electrical circuitry on the substrate. The interconnecting line includes a pad located on the substrate, between the thin semiconductor film and the electrical circuitry. The pad, which is wider than other parts of the interconnecting line, can be used as a probe pad for testing the apparatus, and in particular for testing the electrical circuitry on the substrate before the thin semiconductor film is attached.

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patent: 7061113 (2006-06-01), Fujiwara et al.
patent: 10-150221 (1998-06-01), None

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