Semiconductor apparatus, led head, and image forming apparatus

Details Semiconductor apparatus, led head, and image forming apparatus Semiconductor apparatus, led head, and image forming apparatus

2006-06-13

2006-06-13

Tran, Mai-Huong (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257S758000, C257S761000, C257S763000, C257SE23160

Reexamination Certificate

active

07061113

ABSTRACT:
A semiconductor apparatus has a substrate to which is attached a thin semiconductor film including at least one semiconductor device. A first interconnecting line formed on the thin semiconductor film makes electrical contact with the semiconductor device. A second interconnecting line extends from the thin semiconductor film to the substrate, electrically coupling the first interconnecting line to an interconnection pattern on the substrate. At the point where the first and second interconnecting lines meet, one of the two interconnecting lines is widened to provide an increased positioning margin, thereby relaxing the requirement for precise positioning of the thin semiconductor film. The thin semiconductor film may include an array of light-emitting diodes and the substrate may include driving circuitry for driving them.

REFERENCES:
patent: 6545359 (2003-04-01), Ohtani et al.
patent: 10-150221 (1998-06-01), None

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