Semiconductor apparatus having wiring structure of an integrated

Details Semiconductor apparatus having wiring structure of an integrated Semiconductor apparatus having wiring structure of an integrated

1996-02-29

1997-01-14

Monin, Jr., Donald L.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

257774, 257920, 257923, H01L 2348, H01L 2944

Patent

active

055942814

ABSTRACT:
In a semiconductor apparatus, a first circuit provided on a major surface of a semiconductor substrate. The first circuit includes a plurality of logic circuits of an identical structure, the logic circuits having input terminals supplied with identical signals. First metal wiring is provided on the semiconductor substrate in a direction identical to a direction of arrangement of the logic circuits, the first metal wiring being connected to one of the input terminals of each of the logic circuits. A second circuit provided on the major surface of the semiconductor substrate in an outside area which does not overlap an area extending in a direction perpendicular to the direction of arrangement of the logic circuits, the second circuit supplying an identical signal to the input terminals of the logic circuits of the first circuit. A second metal wiring is connected between an output terminal of the second circuit and a substantially middle point of the first metal wiring. The second metal wiring has a portion situated in parallel to the logic circuits. Thereby, an influence of wiring delay due to a difference in distances among the logic circuits can be reduced and a high-speed operation is achieved.

REFERENCES:
patent: 4782253 (1988-11-01), Shoji
patent: 5294837 (1994-03-01), Takase et al.
European Serarch Report, dated Jan. 11, 1995, appl. No. 94113133.6

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