Semiconductor apparatus having a cooling apparatus that...

Details Semiconductor apparatus having a cooling apparatus that... Semiconductor apparatus having a cooling apparatus that...

2005-05-20

2008-03-25

Williams, Alexander Oscar (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257SE23021, C257SE23044, C257SE23046, C257SE23054, C257S717000, C257S718000, C257S719000

Reexamination Certificate

active

07348664

ABSTRACT:
A semiconductor device comprises a semiconductor die, first and second electrically-conductive leads and first and second thermal elements. The die comprises first and second surfaces. The first lead is held in contact with the first surface of the die by a compressive force. The first thermal element is held in contact with a portion of the first lead by a compressive force such that the first thermal element is capable of removing heat from the first lead and from the die. The second lead is held in contact with the second surface of the die by a compressive force. The second thermal element is held in contact with a portion of the second lead by a compressive force such that the second thermal element is capable of removing heat from the second lead and from the die.

REFERENCES:
patent: 6442033 (2002-08-01), Liu et al.
patent: 6452261 (2002-09-01), Kodama et al.
patent: 6770986 (2004-08-01), Nagao et al.
patent: 6774466 (2004-08-01), Kajiwara et al.
patent: 2002/0145188 (2002-10-01), Kodama et al.

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