Semiconductor apparatus, fabrication method therefor and board f

Details Semiconductor apparatus, fabrication method therefor and board f Semiconductor apparatus, fabrication method therefor and board f

1997-03-13

1998-03-24

Picardat, Kevin

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

438123, 438125, H01L 2160

Patent

active

057312311

ABSTRACT:
A semiconductor apparatus has a wiring board having a wiring pattern and a plurality of connection electrodes formed on a surface thereof with the connection electrodes being electrically connected to the wiring pattern. A semiconductor device is mounted on a main surface of the wiring board and electrically connected to the wiring pattern. A resin-sealed structure is formed by a transfer mold for coating the main surface of the wiring board and the semiconductor device and having sides with a predetermined taper angle after coating. Those side edge portions of the resin-sealed structure which contact the main surface of the wiring board are in contact with edge portions of respective sides of the wiring board.

REFERENCES:
patent: 5336639 (1994-08-01), Nagaraj et al.
patent: 5422314 (1995-06-01), Sekiba
patent: 5474958 (1995-12-01), Djennas et al.
patent: 5527740 (1996-06-01), Golwalkar et al.

Affiliated with

Also associated with

Rating

Semiconductor apparatus, fabrication method therefor and board f does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor apparatus, fabrication method therefor and board f, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor apparatus, fabrication method therefor and board f will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2288452