Semiconductor apparatus configured with a lead frame having...

Details Semiconductor apparatus configured with a lead frame having... Semiconductor apparatus configured with a lead frame having...

2008-06-24

2008-06-24

Thai, Luan (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S680000, C257S787000, C257S788000, C257S684000, C257S692000, C257S723000, C257SE23039

Reexamination Certificate

active

07391102

ABSTRACT:
Disclosed is a semiconductor apparatus including: a first molded resin portion; a plate-shaped lead frame closely attached to the first molded resin portion; a second molded resin portion attached facing the first molded resin portion and the lead frame; and one or more elements attached on the lead frame on a side which faces the second molded resin portion, the one or more elements including a semiconductor element, wherein any part of at least one of the elements does not exist in a region composed of an aggregation of line segments, each line segment being formed by any two points on an outer periphery of the plate-shaped lead frame outside the first and second molded resin portions and all of the line segments being contained inside a board of the lead frame.

REFERENCES:
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patent: 2002/0123223 (2002-09-01), Van Rijckevorsel et al.
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patent: 2003-031885 (2003-01-01), None
JP Office Action dtd Sep. 11, 2007, JP Appln. 2003-355245 w/English Summary.

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