Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2006-06-20
2006-06-20
Graybill, David E. (Department: 2822)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S617000, C438S459000, C438S977000
Reexamination Certificate
active
07064005
ABSTRACT:
A semiconductor apparatus that allow miniaturization of a multichip module using an interposer substrate and a method of manufacturing the same are provided. It is configured that an embedded electrode (4) penetrating through an interposer substrate (1) is provided, one end thereof is made to be connected to a connection electrode (2) on which device chips (10) are flip-chip mounted, and connecting to an unillustrated mounting substrate via a bump electrode (5), that is, because an electrode connecting the mounting substrate is made to be drawn out from the back surface of the interposer substrate (1), a multichip module can be miniaturized.
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Graybill David E.
Sonnenschein Nath & Rosenthal LLP
Sony Corporation
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