Semiconductor apparatus and method for fabricating the same

Details Semiconductor apparatus and method for fabricating the same Semiconductor apparatus and method for fabricating the same

1997-08-22

1999-11-16

Saadat, Mahshid

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With dam or vent for encapsulant

257670, 257666, H01L 23495

Patent

active

059863331

ABSTRACT:
A semiconductor apparatus includes a semiconductor chip and a die pad on which the semiconductor chip is mounted. The die pad is provided thereon with an opening. The semiconductor chip and the die pad may be shaped to be similar figures of rectangle, and the opening may include a plurality of first slits which are arranged around the corners of the die pad, respectively.

REFERENCES:
patent: 5150193 (1992-09-01), Yasuhara et al.
patent: 5338973 (1994-08-01), Yoshigai
patent: 5545923 (1996-08-01), Barber
patent: 5641987 (1997-06-01), Lee
patent: 5708294 (1998-01-01), Toriyama
patent: 5712507 (1998-01-01), Eguchi et al.
patent: 5763942 (1998-06-01), Suzuki

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