Semiconductor apparatus and manufacturing method thereof

Details Semiconductor apparatus and manufacturing method thereof Semiconductor apparatus and manufacturing method thereof

2007-12-04

2011-10-04

Ngo, Ngan (Department: 2893)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257S686000, C257S706000, C257SE23101, C257SE21505, C438S122000

Reexamination Certificate

active

08030760

ABSTRACT:
A semiconductor apparatus includes a semiconductor device, a cooler of a forced cooling type, and a heat mass. Heat generated in the semiconductor device is conducted to the cooler. The heat mass comes into junction with the semiconductor device with solder so as to be thermally combined with the semiconductor device. The heat mass functions also as an electrode.

REFERENCES:
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patent: 7217997 (2007-05-01), Wyland
patent: 2002/0088797 (2002-07-01), Ramaswamy et al.
patent: 2003/0116836 (2003-06-01), Huang et al.
patent: 2004/0037044 (2004-02-01), Cook et al.
patent: 2007/0080471 (2007-04-01), Yazawa
patent: 5-13660 (1993-02-01), None
patent: 2000-323630 (2000-11-01), None
patent: 2002-270765 (2002-09-01), None

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