Semiconductor apparatus and its manufacturing method

Details Semiconductor apparatus and its manufacturing method Semiconductor apparatus and its manufacturing method

1994-08-15

1996-05-28

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

257666, H01L 23495

Patent

active

055214304

ABSTRACT:
A hole is formed in a metal plate, and after a concave portion is formed by pressurizing a predetermined area on the metal plate including the hole to cause plastic deformation, an island of a lead frame is formed in the concave portion. By forming the concave portion, the island and the inner lead are thinner than the outer lead, and the hole which has become smaller remains in the island.

REFERENCES:
patent: 3436810 (1969-04-01), Kauffman
patent: 3559285 (1971-02-01), Kauffman
patent: 3574815 (1971-04-01), Segerson
patent: 4099200 (1978-07-01), Koutalides
patent: 4942452 (1990-07-01), Kitano et al.
patent: 4942454 (1990-07-01), Mori et al.
patent: 5221859 (1993-06-01), Kobayashi et al.
patent: 5223240 (1993-06-01), Ishikawa et al.
patent: 5233222 (1993-08-01), Diennas et al.
patent: 5329158 (1994-07-01), Lin

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