Semiconductor apparatus and fabricating method for the same

Details Semiconductor apparatus and fabricating method for the same Semiconductor apparatus and fabricating method for the same

2006-02-07

2006-02-07

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S737000, C257S734000, C257S780000, C228S180220

Reexamination Certificate

active

06995469

ABSTRACT:
This conductor apparatus mounts through a bump a semiconductor chip having an electrode pad on a circuit board having a connection pad at a position opposite to the electrode pad. The bump comprises a first protruding electrode provided on the electrode pad, a second protruding electrode provided on the connection pad, and an electroconductive connection member which integrally covers peripheral surfaces of the first and second protruding electrodes and solid-phase-diffusion-connects these protruding electrodes.

REFERENCES:
patent: 5090119 (1992-02-01), Tsuda et al.
patent: 5786271 (1998-07-01), Ohida et al.
patent: 6297562 (2001-10-01), Tilly
patent: 6311888 (2001-11-01), Funada et al.
patent: 6335571 (2002-01-01), Capote et al.
patent: 6344695 (2002-02-01), Murayama
patent: 6590287 (2003-07-01), Ohuchi
patent: 6798072 (2004-09-01), Kajiwara et al.
patent: 2001/0026015 (2001-10-01), Ikegami et al.
patent: 2002/0153608 (2002-10-01), Okada et al.

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