Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – For liquid etchant
Reexamination Certificate
2006-05-05
2009-12-22
MacArthur, Sylvia R. (Department: 1792)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
For liquid etchant
C156S345170, C134S104100
Reexamination Certificate
active
07635417
ABSTRACT:
A semiconductor apparatus for processing a wafer comprises a stage, a fluid supply unit, and a cleaning unit. The stage supports the wafer. The fluid supply unit provides a first fluid, wherein the fluid supply unit is moveable between a second position and a first position. The cleaning unit provides a second fluid, wherein when the fluid supply unit is in the first position, the fluid supply unit provides the first fluid toward the wafer, and when the fluid supply unit is in the second position, the cleaning unit blows the second fluid toward a surface of the fluid supply unit to clean the surface thereof.
REFERENCES:
patent: 6210481 (2001-04-01), Sakai et al.
patent: 6357457 (2002-03-01), Taniyama et al.
patent: 7479205 (2009-01-01), Okuda et al.
Lin Chien-Fang
Lu Jen-Chih
Birch & Stewart Kolasch & Birch, LLP
MacArthur Sylvia R.
Taiwan Semiconductor Manufacturing Co. Ltd.
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