Semiconductor apparatus

Details Semiconductor apparatus Semiconductor apparatus

2005-03-16

2009-02-24

Tran, Long K (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

C257S788000, C257S789000, C257S795000, C257SE21499, C257SE23116

Reexamination Certificate

active

07495344

ABSTRACT:
A semiconductor apparatus includes a substrate and elements or semiconductor chips provided on the substrate. The elements are sealed by being brought into contact with a sealing compound. The surface of contact on the elements or the sealing compound is plasma treated. The semiconductor chip is adhesively attached to another semiconductor chip via an adhesive compound. The surface of the semiconductor chip in contact with the adhesive compound is plasma treated.

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