Semiconductor apparatus

Details Semiconductor apparatus Semiconductor apparatus

2007-08-14

2007-08-14

Tran, Minhloan (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S706000, C257S707000, C257SE23048, C257SE23051, C257S150000, C257S177000

Reexamination Certificate

active

10979563

ABSTRACT:
In a semiconductor apparatus in which a main current of a semiconductor device flows through a wiring pattern formed on an insulation circuit board, the rise in temperature of the wiring pattern is suppressed and the increase in cost of parts can be minimized. On the insulation circuit board, a copper pattern is formed. A heat spreader is soldered to the copper pattern, and the heat spreader is loaded with a semiconductor chip. An external electrode and the heat spreader are arranged to shorten the distance between the side of the external electrode and the side of the heat spreader.

REFERENCES:
patent: 5466969 (1995-11-01), Tsunoda
patent: 5559374 (1996-09-01), Ohta et al.
patent: 5751058 (1998-05-01), Matsuki
patent: 5917234 (1999-06-01), Tsuruzono
patent: 6791167 (2004-09-01), Hayashi et al.
patent: 2004/0041253 (2004-03-01), Yamada et al.
patent: 02-306640 (1990-12-01), None
patent: 06-275926 (1994-09-01), None
Notice of Rejection Grounds for Patent Application dated Sep. 2, 2004, issued in Taiwanese counterpart application.
Korean Office Action dated Dec. 12, 2006 for Korean Patent Application No. 2004-88136.

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