Semiconductor and method for producing a semiconductor

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip

Reexamination Certificate

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C257S723000, C257S686000, C438S109000, C438S110000

Reexamination Certificate

active

11210387

ABSTRACT:
A semiconductor device comprises at least one first semiconductor component being located in a first plane and comprising an active area which has a first contact region and at least one second semiconductor component being located in a second plane and comprising a second active area which has a second contact region. The second semiconductor component is located at a distance vertically to the first semiconductor component and is orientated relative to the first semiconductor component, so that the first active area faces away from the second semiconductor component and the second active area faces away from the first semiconductor component. An adhesive layer is arranged between the first and the second semiconductor components and a frame region adjoins laterally the first semiconductor component and the second semiconductor component on at least one side. The frame region comprises a first surface and a second surface which is located opposite to the second surface. A wiring device is introduced in the frame region and connects the first contact region to the second contact region.

REFERENCES:
patent: 5939779 (1999-08-01), Kim
patent: 6093584 (2000-07-01), Fjelstad
patent: 6118176 (2000-09-01), Tao et al.
patent: 6177721 (2001-01-01), Suh et al.
patent: 6506632 (2003-01-01), Cheng et al.
patent: 6696320 (2004-02-01), Gacusan
patent: 2002/0146859 (2002-10-01), Akagawa
patent: 2004/0084771 (2004-05-01), Bolken et al.

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