Semiconductor and electronic device with spring terminal

Details Semiconductor and electronic device with spring terminal Semiconductor and electronic device with spring terminal

2007-03-06

2007-03-06

Flynn, Nathan J. (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S177000, C257S178000, C257S690000, C257S698000, C257S678000, C257S687000, C336S090000

Reexamination Certificate

active

11148013

ABSTRACT:
A semiconductor or electronic device, such as a power module uses at least one spring terminal as a control terminal. The spring terminal is led outside a case through a coil-accommodating member, which can be a frame or removable cover. With this arrangement, the spring terminal can be arranged at an arbitrary position inside the case. The spring terminal can be joined by soldering or bonding to the electrode of an in-case substrate while being held by the frame or cover. The in-case substrate can be accessed for solder joining through at least one aperture formed in the frame.

REFERENCES:
patent: 6958534 (2005-10-01), Stockmeier et al.
patent: 2004/0245548 (2004-12-01), Stockmeier et al.
patent: 1 381 115 (2004-01-01), None
patent: 6-302734 (1994-06-01), None
patent: 2001-189416 (2001-07-01), None
Annacker, R. et al., A New Platform for IGBT Modules, Flexible and expandable SEMiX family, PCLM Europe, Jul./Aug., 2003, p. 46-47.
SEMIKRON, Trade Catalog, SemiX 353GB126HDs, “Spring contact pad,” p. 1-2.

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