Semiconductor accommodating devices and method for inserting and

Details Semiconductor accommodating devices and method for inserting and Semiconductor accommodating devices and method for inserting and

1997-10-14

1999-08-03

Noland, Kenneth

Article dispensing

Processes

221 74, B65G 5900

Patent

active

059313374

ABSTRACT:
A semiconductor accommodating device using an embossed tape and a method for inserting and taking out semiconductor devices, without using a top cover tape that had hitherto been used. The semiconductor accommodating device comprises a reel and an embossed tape wound on the reel. The embossed tape has a bottom wall for placing a semiconductor device thereon, two side walls upwardly extending from both side edges of the boom wall, and top walls having an opening. The side walls are formed such that the semiconductor device inserted through the opening is held by the side walls with the semiconductor device placed on the bottom wall.

REFERENCES:
patent: 4494902 (1985-01-01), Kuppens et al.
patent: 5259911 (1993-11-01), Ohnishi et al.

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