Semiconductor accelerometer with damperless structure

Details Semiconductor accelerometer with damperless structure Semiconductor accelerometer with damperless structure

1994-02-18

1996-04-16

Chilcot, Richard

Measuring and testing

Speed, velocity, or acceleration

Angular rate using gyroscopic or coriolis effect

7350415, G01P 1508

Patent

active

055071821

ABSTRACT:
A semiconductor accelerometer which can satisfy the requirements of both the sensitivity and the fracture strength without any contrivance for providing viscous liquid and beam stopper material is provided. A casing comprises a stem and a shell. The casing houses an accelerometer chip. The silicon accelerometer chip is of double cantilever beam structure. Each beam is provided with piezo resistance layers. The motion of the beams due to the action of acceleration is converted into electrical signals. The resonant frequency of the beams of the accelerometer chip is above the resonant frequency of the casing itself, so that the acceleration components above this resonant frequency are damped by the casing and therefore most acceleration components in the resonant frequency of the beam are damped. As a result, the beams of the accelerometer chip can be protected from the impacts due to the dropping of the accelerometer, or the like.

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Koide et al, "A Multistep Anisotropic Etching Process For Producing 3-D Silicon Accelerometers", Technical Digest of the 11th Sensor Symposium, 1992, pp. 23-26.
Terry et al, "A Miniature Silicon Accelerometer With Built-In Damping", IEEE Solid-State Sensor and Actuator Workshop, 1988, pp. 1-3.

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