Measuring and testing – Speed – velocity – or acceleration – Structural installation or mounting means
Reexamination Certificate
2005-01-28
2009-08-04
Kwok, Helen C. (Department: 2856)
Measuring and testing
Speed, velocity, or acceleration
Structural installation or mounting means
C073S514330
Reexamination Certificate
active
07568390
ABSTRACT:
Although a weight part of an acceleration sensor chip fixed on a die pad is coated with a gelatinous resin part of low elasticity, the weight part is easily displaced by an external acceleration. Thus, an acceleration can be detected with accuracy. Furthermore, long-term reliability equal to those of regular resin packages is ensured because those portions of an acceleration sensor device which are not used for acceleration sensing are sealed with a resin part.
REFERENCES:
patent: 4933744 (1990-06-01), Segawa et al.
patent: 5507182 (1996-04-01), Yamada et al.
patent: 5783750 (1998-07-01), Otani
patent: 5864062 (1999-01-01), Nagahara et al.
patent: 5866818 (1999-02-01), Sumi et al.
patent: 5948991 (1999-09-01), Nomura et al.
patent: 6049120 (2000-04-01), Otani et al.
patent: 6094984 (2000-08-01), Asano et al.
patent: 6201285 (2001-03-01), Iwata et al.
patent: 6316840 (2001-11-01), Otani
patent: 6323529 (2001-11-01), Nagahara
patent: 6372351 (2002-04-01), Takemiya et al.
patent: 6435028 (2002-08-01), Nagahara
patent: 6979873 (2005-12-01), Fujii
patent: 7100448 (2006-09-01), Ikegami
patent: 01-143963 (1989-06-01), None
patent: 07-225240 (1995-08-01), None
patent: 10-197374 (1998-07-01), None
Kwok Helen C.
Oki Semiconductor Co., Ltd.
Studebaker Donald R.
Studebaker & Brackett PC
LandOfFree
Semiconductor acceleration sensor device and method for... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor acceleration sensor device and method for..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor acceleration sensor device and method for... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4127330