Semiconductor acceleration sensor and manufacturing method...

Details Semiconductor acceleration sensor and manufacturing method... Semiconductor acceleration sensor and manufacturing method...

2007-07-31

2007-07-31

Kwok, Helen (Department: 2856)

Measuring and testing

Speed, velocity, or acceleration

Acceleration determination utilizing inertial element

C073S514290

Reexamination Certificate

active

11244041

ABSTRACT:
A semiconductor acceleration sensor in which a reduction in size can be achieved when electrodes are formed in a chip main body and acceleration can be measured with good sensitivity. The semiconductor acceleration sensor comprises a weight section, flexible sections which support the weight section and have measurement elements P, and a chip main body which has a front surface having chip electrodes electrically connected with the measurement elements, and support the flexible sections, wherein an additional weight, which has an inclined face which surrounds a bonding section and decreases its size toward the bonding section, is bonded on the front surface of the weight section.

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patent: 5295386 (1994-03-01), Okada
patent: 5490421 (1996-02-01), Ueyanagi
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patent: 05-264575 (1993-10-01), None
patent: 6-242139 (1994-09-01), None
patent: 7-005192 (1995-01-01), None
patent: 8-054413 (1996-02-01), None

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