Semiconductor acceleration sensor

Details Semiconductor acceleration sensor Semiconductor acceleration sensor

2006-01-20

2008-12-16

Kwok, Helen C. (Department: 2856)

Measuring and testing

Speed, velocity, or acceleration

Acceleration determination utilizing inertial element

C073S514380

Reexamination Certificate

active

07464591

ABSTRACT:
A semiconductor acceleration sensor having beam parts formed in substantially L-shape to surround a weight part, wherein formed to surround a square part, as seen in plan view and constituting the weight part, are two elongated L-shaped beam parts, at locations close to proximal end portions of which are formed protruding portions protruding from a fixed part toward the weight part, and receiving recessed portions protruding from the weight part toward the fixed part to surround the protruding portions. The protruding portions have an outer shape substantially the same as an inner wall surface of the receiving recessed portions so that movements of the weight part in any directions in a horizontal direction perpendicular to an up and down direction are limited as a result of reception of the protruding portions by the receiving recessed portions. Thus, even when a side impact is applied to the acceleration sensor, the weight part is prevented from moving significantly, thereby preventing an excessive stress from being applied to the beam parts to break the beam parts.

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English Language Abstract of JP 8-240609.
English Language Abstract of JP 2000-346866.
English Language Abstract of JP 11-337570.
English Language Abstract of JP 2002-055117.
English Language Abstract of JP 2000-338124.
English Language Abstract of JP 7-159432.
U.S. Appl. No. 10/599,396 to Meshii et al., filed Sep. 27, 2006.

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