Semiconductive resin composition

Details Semiconductive resin composition Semiconductive resin composition

1984-10-18

1987-09-29

Barr, Josephine L.

Compositions

Electrically conductive or emissive compositions

Elemental carbon containing

524495, 524496, H01B 106

Patent

active

046967656

ABSTRACT:
A semiconductive resin composition used in power cables having excellent properties is disclosed, which comprises 100 parts by weight of a base resin of at least one member selected from the group consisting of a low-density polyethylene, an ethylene/vinyl acetate copolymer having a vinyl acetate content of 25% by weight or less and an ethylene/(meth)acrylate copolymer having a (meth)acrylate content of 20% by weight or less, and 6 to 25 parts by weight of electroconductive carbon black having a DBP-absorption number of 220 to 340 ml/100 g and an impurity metal residue of 0.2% by weight or less.

REFERENCES:
patent: 4246142 (1981-01-01), Ongchin
patent: 4421678 (1983-12-01), Mehta
patent: 4493787 (1985-01-01), Taniguchi et al.
patent: 4587039 (1986-05-01), Yamaoka et al.

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