Semiconductive polyvinylidene fluoride resin composition

Details Semiconductive polyvinylidene fluoride resin composition Semiconductive polyvinylidene fluoride resin composition

2005-01-25

2005-01-25

Kopec, Mark (Department: 1751)

Compositions

Electrically conductive or emissive compositions

Elemental carbon containing

C524S157000

Reexamination Certificate

active

06846436

ABSTRACT:
A semiconductive polyvinylidene fluoride resin composition comprising 100 parts by weight of a polyvinylidene fluoride resin, 0.03 to 10 parts by weight of at least one tetraalkylammonium salt selected from the group consisting of tetraalkylammonium sulfates and tetraalkylammonium sulfites, and 1 to 20 parts by weight of conductive carbon black. A formed or molded product composed of the semiconductive polyvinylidene fluoride resin composition.

REFERENCES:
patent: 3703569 (1972-11-01), Wolkowicz
patent: 3829408 (1974-08-01), Wolkowicz
patent: 4013531 (1977-03-01), Nakamura et al.
patent: 6610766 (2003-08-01), Kitamura et al.
patent: 0333062 (1989-09-01), None
patent: 0942038 (1999-09-01), None
patent: 47-3835 (1972-02-01), None
patent: 51-32330 (1976-03-01), None
patent: 51-110658 (1976-09-01), None
patent: 51-111337 (1976-10-01), None
patent: 54-127872 (1979-10-01), None
patent: 55-26973 (1980-07-01), None
patent: 60-177064 (1985-09-01), None
patent: 61-72061 (1986-04-01), None
patent: 6-329861 (1994-11-01), None
patent: 7-003100 (1995-01-01), None
patent: 8-059940 (1996-03-01), None
patent: 8-272208 (1996-10-01), None
patent: 11-029678 (1999-02-01), None
patent: 11-323052 (1999-11-01), None

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