Semiconductive filling compound for power cable with improved pr

Details Semiconductive filling compound for power cable with improved pr Semiconductive filling compound for power cable with improved pr

1976-11-05

1978-08-01

Grimley, Arthur T.

Electricity: conductors and insulators

With fluids or vacuum

With fluid stops

156 48, 174107, 174110PM, 174110AR, H01B 728

Patent

active

041044800

ABSTRACT:
This invention is an improved filling compound for preventing moisture penetration along the interior of high voltage electric power cables. Amorphous polypropylene, mixed with carbon where it must be semiconductive, is an extremely good filling compound because of its electrical characteristics and also because of its good flow characteristics when extruding. When the cable is to be used under conditions where it must withstand temperatures so low that the polypropylene becomes brittle, it can be blended with polyisobutylene rubber to withstand lower temperatures, but the blend must be kept within limits to prevent loss of the good flow characteristics of the amorphous polypropylene.

REFERENCES:
patent: 3642638 (1972-02-01), Kitano
patent: 3671663 (1972-06-01), Seifert et al.
patent: 3697670 (1972-10-01), Mitacek
patent: 3728466 (1973-04-01), Rocton et al.
patent: 3830953 (1974-08-01), Wood et al.
patent: 3885085 (1975-05-01), Bahder et al.
patent: 3888710 (1975-06-01), Burk
patent: 3943271 (1976-03-01), Bahder et al.

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