Semiconductive chip having a bond pad located on an active...

Details Semiconductive chip having a bond pad located on an active... Semiconductive chip having a bond pad located on an active...

2006-06-13

2006-06-13

Pham, Hoai (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C257S734000, C257S735000, C257S736000

Reexamination Certificate

active

07060525

ABSTRACT:
A semiconductive chip having at least one active device, and at least one bond pad located on said active device. The bond pad has at least one deformable member, and the deformable member is deformable when conductive stud is bonded to said bond pad so as to prevent damage to the active device during the bonding of the conductive stud to the bond pad, such as by an ultrasonic bonding technique. A plurality of the deformable members may define a pattern on the bond pad that deforms when the conductive stud is bonded to the bond pad.

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