Semiconducting resin compositions

Compositions – Electrically conductive or emissive compositions – Elemental carbon containing

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524504, 525 83, 525 84, 525 85, 174102SC, 174105SC, 174106SC, 428375, H01B 516, C08K 304

Patent

active

044129386

ABSTRACT:
A semiconducting resin composition comprises: (A) 100 to 40 parts of a modified ethylene-vinyl acetate copolymer prepared by graft processing of 100 parts of an ethylene-vinyl acetate copolymer of a vinyl acetate content of less than 35 percent with 25 to 200 parts of an aromatic vinyl monomer; (B) 0 to 60 parts of a rubber; and (C) 3 to 150 parts of a carbon black with respect to 100 parts of the above described components (A) and (B), all quantities in "parts" and "percent" being by weight. A composition of this character has excellent characteristics for its use in forming the outer semiconducting layer of polyethylene-insulated cables.

REFERENCES:
patent: Re28336 (1975-02-01), Dalton
patent: 3162696 (1964-12-01), Zimmerman et al.
patent: 3178384 (1963-04-01), Rice et al.
patent: 3218373 (1963-11-01), Salyer
patent: 3547756 (1970-12-01), Oberst et al.
patent: 3562090 (1971-02-01), Oberst et al.
patent: 3684821 (1972-08-01), Miyauchi et al.
patent: 3849345 (1974-11-01), Snavely
patent: 3862056 (1975-01-01), Hartman
patent: 4064198 (1977-12-01), Zeitler et al.
Sneed et al., "Comprehensive Inorganic Chemistry", pp. 18-24.
Derwent Abst. 90094 B/50 (11-1-79) J54140992 Hitachi Cable "Conductive Compsni . . . ".
Derwent Abst. 35038 Y/20 (4-1-77) (J52042295) Nippon Kokven Kogyo "Thermoplastic Resin . . . ".
Derwent Abst. 35515 Y/20 (4-8-77) (J52045091) Nippon Kokven Kogyo "Flexible Sheet . . . ".
Derwent Abst. 53279 Y/30 (6-15-77) (J52071694) Nippon Unicar KK "Semiconductive Resin Comps . . . ".

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