Semiconducting device with stacked dice

Details Semiconducting device with stacked dice Semiconducting device with stacked dice

2004-03-31

2008-05-27

Smoot, Stephen W. (Department: 2813)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S777000, C257SE23003

Reexamination Certificate

active

07378725

ABSTRACT:
Some embodiments of the present invention relate to a semiconducting device and method that include a substrate and a first die that is attached to the substrate. The first die includes active circuitry (e.g., a flash memory array or logic circuitry) on an upper surface of the first die. The semiconducting device further includes a spacer that covers the active circuitry on the upper surface of the first die and a second die that is stacked onto the spacer and the first die. The spacer extends from a first side of the first die to an opposing second side of the first die. The spacer also extends near a third side of the first die and an opposing fourth side of the first die such that the active circuitry is exposed near the third and fourth sides of the first die.

REFERENCES:
patent: 4910643 (1990-03-01), Williams
patent: 5506753 (1996-04-01), Bertin et al.
patent: 5909058 (1999-06-01), Yano et al.
patent: 6002165 (1999-12-01), Kinsman
patent: 6060774 (2000-05-01), Terui
patent: 6184064 (2001-02-01), Jiang et al.
patent: 6208521 (2001-03-01), Nakatsuka
patent: 6225695 (2001-05-01), Chia et al.
patent: 6297548 (2001-10-01), Moden et al.
patent: 6433418 (2002-08-01), Fujisawa et al.
patent: 6493861 (2002-12-01), Li et al.
patent: 6861366 (2005-03-01), Katz
patent: 2002/0125580 (2002-09-01), Wang et al.
patent: 2002/0140073 (2002-10-01), Pai et al.
patent: 2002/0185744 (2002-12-01), Katagiri et al.
patent: 2002/0195697 (2002-12-01), Mess et al.
patent: 2003/0047813 (2003-03-01), Goller et al.
patent: 2003/0062614 (2003-04-01), Larson
patent: 2003/0062628 (2003-04-01), Lee et al.
patent: 2003/0111716 (2003-06-01), Ano
patent: 2003/0148597 (2003-08-01), Tan et al.
patent: 2003/0160312 (2003-08-01), Lo et al.
patent: 2004/0033701 (2004-02-01), Ahn et al.
patent: 2004/0039859 (2004-02-01), He et al.
patent: 2005/0194674 (2005-09-01), Thomas et al.
patent: 63-287026 (1988-11-01), None

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