Semiaromatic polyamide molding compositions and their use

Details Semiaromatic polyamide molding compositions and their use Semiaromatic polyamide molding compositions and their use

2011-04-19

2011-04-19

Kiliman, Leszek (Department: 1788)

Stock material or miscellaneous articles

Composite

Of polyamide

C428S475500, C524S397000, C524S447000, C524S449000, C524S451000, C524S494000, C524S496000, C524S500000

Reexamination Certificate

active

07927710

ABSTRACT:
A polyamide molding composition having the constitution from 30 to 100% by weight of at least one 10T/6T copolyamide composed of from 40 to 95 mol % of 10T units, and from 5 to 60 mol % of 6T units, from 0 to 70% by weight of reinforcing materials and/or fillers, and from 0 to 50% by weight of additives and/or further polymers. Uses and processes for the preparation of this polyamide molding composition are described.

REFERENCES:
patent: 3454536 (1969-07-01), Blaschke et al.
patent: 4607073 (1986-08-01), Sakashita et al.
patent: 69630260 (1899-12-01), None
patent: 1495393 (1969-04-01), None
patent: 19513940 (1996-01-01), None
patent: 2002-293926 (2002-10-01), None
patent: 2004/015010 (2004-02-01), None

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