Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate
2007-01-30
2007-01-30
Whitehead, Jr., Carl (Department: 2813)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Including adhesive bonding step
C438S122000, C257SE23109
Reexamination Certificate
active
10909206
ABSTRACT:
To accommodate high power densities associated with high performance integrated circuits, an integrated circuit package includes a heat-dissipating structure in which heat is dissipated from a surface of a die to an integrated heat spreader (IHS) through a high capacity thermal interface formed of metal that has been injected in a semi-solid state. In one embodiment, vacuum and a shear-controlled viscosity enable semi-solid metallic material to fill a narrow chamber between the die surface and a specially shaped mold plate that doubles as an IHS, without inducing voids in the solidified metal. In another embodiment, an injection machine is disclosed. Methods of fabrication, as well as application of the package to an electronic assembly and to an electronic system, are also described.
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Koning Paul A.
Rinella Agostino C.
Dolan Jennifer M.
Schwegman Lundberg Woessner & Kluth P.A.
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