Cleaning compositions for solid surfaces – auxiliary compositions – Cleaning compositions or processes of preparing – For cleaning a specific substrate or removing a specific...
Reexamination Certificate
2002-11-15
2004-12-07
Gupta, Yogendra N. (Department: 1751)
Cleaning compositions for solid surfaces, auxiliary compositions
Cleaning compositions or processes of preparing
For cleaning a specific substrate or removing a specific...
C510S396000, C510S403000, C510S445000
Reexamination Certificate
active
06828291
ABSTRACT:
FIELD OF THE INVENTION
The present invention relates to semi-solid cured product removing compositions, particularly well suited to removal of cured product for example polymerized adhesive, from a substrate. In particular the semi-solid cured product removing compositions of the present invention are suited to removal of cured adhesives such as polycyanoacrylate from substrates.
BRIEF DESCRIPTION OF RELATED TECHNOLOGY
Many types of curable products including adhesives are known and are well documented. Known curable products may be aerobic or anaerobic (cure in the absence of air) and may be formulated in one-or two-part compositions. The curable products may be adhesives, coatings, sealants and such like.
Many curable products present a certain amount of difficulty to users. For instance if curable product is spilled, misplaced, or otherwise makes its way onto an undesired substrate and cures there, it can be difficult to remove later on. Cured product can be removed for example by scraping, by use of further solvent or otherwise. One typical scenario is where the user of, for example an adhesive, mishandles, applies incorrectly or spills the product resulting in unwanted curing of the product, which may be on the skin of the hands etc. Instant adhesives are particularly prone to curing at unintended sites as they leave little or no time for removal before curing. Removal by washing with detergent or solvent may help to remove cured product. Solvents may be volatile evaporating before they have acted sufficiently on the cured product to assist in its removal. Cyanoacrylates are examples of adhesives which are commonly available. Most cyanoacrylate adhesives are instant adhesives curing within a short time of being applied. The cure speed of cyanoacrylates is often of the order of seconds or fractions of a second so that these products are difficult to remove.
It would however be desirable to provide a convenient way to remove such polymerized or cured composition which allowed for ease and convenience of removal of cured product. It would be particularly desirable to provide, an easy to use cured product remover, which could be easily applied to the undesired cured product and which would assist in the removal of the cured product.
It is well known for instance to formulate adhesives as “stick” compositions. The patent literature on stick adhesives is extensive and covers a broad range of adhesive types, from emulsion adhesives through solvent based adhesives, to contact adhesives as well as gelling and solidifying additives for the preparation of the sticks ranging from thermosetting through natural polymers to inert fillers. A well known example of one such adhesive stick sold under the trade name PrittStick™ by Henkel KGaA which is an emulsion-based adhesive.
In the patent literature the following patents typify adhesive components which have been formulated as soft-solids, and more particularly sticks. U.S. Pat. No. 5,433,775 discloses an adhesive stick consisting of a water based preparation of starch derivatives and a soap gel as the shaping gel-forming component. See also U.S. Pat. No. 5,371,131.
U.S. Pat. No. 3,846,363 relates to an adhesive crayon composition containing a sorbitol-benzaldehyde reaction product as an additive. U.S. Pat. No. 4,639,475 discloses an adhesive stick composed of the reaction product of sorbitol and/or xylitol and benzaldehyde as the gel-forming composition together with an adhesive resin which is the reaction product of methyl vinyl ether/maleic acid anhydride copolymers with partially neutralised acid phosphate esters of non-ionic wetting agents of the lower alkylene oxide adduct type. Any of the gelling or solidifying agents of the prior art may be used in the present invention.
Japanese unexamined patent application laid open (Kokai) 51-103939 describes a stick-like epoxy adhesive and a stick-like epoxy hardening agent which is used therewith. The sticks are obtained by suitably compounding gelling agent or/and water and/or organic solvent with liquid or solution type epoxy adhesive and epoxy hardening agent.
DE 199 57 677 A1, published after the priority date of the present application, of Henkel KGaA, describes a cyanoacrylate adhesive, coating or sealing material which also contains at least one condensation product of an aldehyde or ketone with a polyol. The adhesive may be in stick form.
While a wide variety of sticks have been described, no previous suggestion has been made that a cured product removal composition could be made in stick form.
SUMMARY OF INVENTION
The present invention provides cured product removing composition suitable for formulation/presentation in stick form. The compositions are particularly useful for removal of cured adhesive for example polymerized cyanoacrylate adhesive. The compositions are easy to apply and handle allowing for accuracy in application without running on. They can be easily and conveniently applied to the desired site and will remain there until removed.
In particular the present invention provides:
a cured product removing composition including:
(a) at least one solvent for cured product; and
(b) at least one gelling or solidifying agent, which is solidified in stick form.
The composition, in contrast to known adhesive sticks is absent any cured or uncured polymerizable product. Known adhesive sticks are not suitable for use as cured product removers as these sticks contain polymerizable compounds which will polymerize exacerbating rather than alleviating the problem. It is clear therefore to the person skilled in the art that therefore no polymerisable monomer, or polymerised polymer in the composition, or in the stick if the composition is in stick form. The composition thus consists essentially of components (a) and (b). The composition does not include any components(s) which effect its ability to remove cured products. Components which could potentially effect its ability to remove cured products include polymerisable monomers/oligomers such as those of cyanoacrylate. It will be appreciated by those skilled in the art that the solvents which are useful for polymerized compounds are distinct from those which are suitable for the monomer or oligomer which polymerizes to form the cured product. The compositions of the present invention are most likely to be applied at room temperature under ambient conditions.
The composition is easily cast in stick form and is very useful in this respect. The present invention thus provides a cured product removing composition. In particular the cured product removing composition has been demonstrated as being particularly useful for removal of cured adhesive such as cyanoacrylate.
More particularly, the present invention relates to the preparation and use of a cured product removing composition in stick form. Suitably the composition is in the form of a soft-solid. The composition may be formulated in stick form for example by casting.
Component (b) is suitably the product of at least one aldehyde and/or ketone condensation reaction with a polyol.
Suitable polyols include those with at least one of a 1,2-diol, 1,3 diol or 1,4 diol structure. The diols may additionally have other groups such as ether, acid, amido, cyano, hemiacetal or halogen. Examples of suitable polyols include 1,2-ethandiol, 1,3-propandiol, 1,2-propandiol, 2,3-butandiol, 1,4-butandiol, 2,2-dimethyl-1,3-propandiol, 2,2-bis(hydroxymethyl)-1,3-propandiol, 2-(bromomethyl)-2-(hydroxymethyl)-1,3-propandiol, 1,3,4-butantriol, 1-phenyl-1,2,3-propantriol, 1,2-hexandiol, neopentylglycol, 1,4-bishydroxymethylcyclohexane, 2-methyl-1,3-propandiol, hexantriol-(1,2,6), 2-(2-hydroxyethoxy)butan-1,3,4-glycerine, di and polyglycerine, diglycerindiacetate, trimethylolpropane, di-(trimethylolpropane), trimethylolethane, pentaerythritol, bicyclo [2.2.1] heptane-2,3,5,6-tetrol, 2,2,3,3-tetrahydroxybutandiacid, dipentaerythritol, sorbitol, formitol, xylitol, inositol, glucitol, glucose, saccharose/sucrose, starch, cellulose, ascorbic acid, partially or fully hydrolysed polyvinylacetate, 9,10-d
Guthrie John
Kneafsey Brendan J.
Melody David P.
Baumann Steven C.
Gupta Yogendra N.
Loctite (R&D) Limited
Petruncio John M.
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