Semi-finished products for the manufacture of printed circuit bo

Stock material or miscellaneous articles – Composite – Of silicon containing

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428450, 428463, 427304, B32B 904

Patent

active

046364412

ABSTRACT:
For the electroless metallization of base carriers for the manufacture of printed circuit boards, those carrier materials are outstandingly suitable on which complex compounds are built up in which the ligands and the ions to be complexed have entered a "host-guest interrelationship". Examples of such activator compounds are complexes of crown ethers, cryptands and the like. The resulting printed circuit boards are distinguished by the high adhesive strengths of the metals deposited on them.

REFERENCES:
patent: 3560257 (1971-02-01), Schneble, Jr. et al.
patent: 4248632 (1981-02-01), Ehrich et al.
patent: 4367072 (1983-01-01), Vogtle et al.
patent: 4395527 (1983-07-01), Berger
patent: 4480009 (1984-10-01), Berger
patent: 4499149 (1985-02-01), Berger

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