Patent
1987-10-26
1990-08-07
James, Andrew J.
357 68, 357 45, H01L 2702
Patent
active
049472330
ABSTRACT:
A semi-custom LSI formed on a semiconductor chip includes a plurality of basic cells formed in a central portion of the semiconductor chip, a plurality of input/output cells formed in a peripheral portion of the semiconductor chip, a plurality of bonding pad formed on the input/output cells, and a wiring layer wiring circuit elements in the basic cells and the input/output cells to form a functional circuit and buffers and connecting between the functional circuit, the buffers and the bonding pads, at least one input/output cell having two bonding pads thereon, and one of the two bonding pads being located near an edge of the semiconductor chip, compared to the other.
REFERENCES:
patent: 4766475 (1988-08-01), Kawashima
James Andrew J.
NEC Corporation
Saltz David
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