Semi-conductor mounting apparatus for applying adhesive to a sub

Details Semi-conductor mounting apparatus for applying adhesive to a sub Semi-conductor mounting apparatus for applying adhesive to a sub

1998-08-19

2000-10-10

Beck, Shrive

Coating apparatus

Projection or spray type

Moving projector

427 96, 4272086, 427287, B05B 300, B05D 510

Patent

active

061290408

ABSTRACT:
An apparatus for applying an adhesive pattern to a chip mounting surface by means of an adhesive dispensing head movable in z, y, and z dimensions, contains a first carriage, which is movable in x and y dimensions using first and second actuators. A second carriage with a dispensing head is movable in the z dimension, perpendicular to the chip mounting surface, on a guide mounted on the first carriage. A third actuator is provided with a positioning motor mounted in a stationary manner and an auxiliary carriage displaceable in the z direction. The auxiliary carriage, driven by the positioning motor, runs in a stationary guide. The auxiliary carriage has a positioning surface parallel to the chip mounting surface and a stop, the stop kept in constant contact with the positioning surface. Preferably, this contact is a gliding contact retained by a spring. The apparatus has good dynamic properties which make possible a rapid "drawing" of adhesive patterns with a high degree of precision.

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