Electricity: conductors and insulators – Feedthrough or bushing – Compression
Patent
1989-03-27
1990-02-20
James, Andrew J.
Electricity: conductors and insulators
Feedthrough or bushing
Compression
174 522, H01L 2328
Patent
active
049031198
ABSTRACT:
A semi-conductor device in which a semi-conductor element is sealed with a molding resin is disclosed. In the device, adhesion between a semi-conductor chip and the molding resin is achieved mainly by oxygen-crosslinking between silicon in the semi-conductor chip and silicon in the molding resin. The device exhibits excellent moisture-resistant reliability even after mounting.
REFERENCES:
patent: 2913358 (1959-11-01), Harrington et al.
patent: 4001870 (1977-01-01), Saiki et al.
patent: 4327369 (1982-04-01), Kaplan
Hamada Takatoshi
Ito Satoshi
Kitayama Akiko
Yamaguchi Miho
Crane Sara W.
James Andrew J.
Nitto Electric Industrial Co. Ltd.
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