Semi-conductor chip test probe and process for manufacturing the

Details Semi-conductor chip test probe and process for manufacturing the Semi-conductor chip test probe and process for manufacturing the

1996-10-24

1998-03-03

Graybill, David

Fishing, trapping, and vermin destroying

437228, 29 2501, 371755, 371762, 371765, 371149, H01L 2166, H01L 2168, G01R 102, G01R 1067

Patent

active

057233470

ABSTRACT:
This discloses a probe structure which does not rely on cantilevered wire and which has controlled contact pressure between the probe contacts and the I/O pads on a semi-conductor chip and which comprises a plurality of conductive contact electrodes, electrically coupled to respective leads, formed, on a film stretched across a respective plurality of cavities established in a substrate. The cavities and the contact electrodes are aligned to one another and both positionally match selected I/O pads existing on a semi-conductor chip to be probed.
Also disclosed is a probe utilizing a cantilevered, metalized oxide tongue extending across a cavity.

REFERENCES:
patent: 5012087 (1991-04-01), Littlebury
patent: 5264787 (1993-11-01), Woith et al.
patent: 5386110 (1995-01-01), Toda
patent: 5489812 (1996-02-01), Furuhata et al.

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